Vathys (YC W18) Is Hiring Packaging Engineers to Build the Future of ML Hardware

Title: Advanced Packaging Engineer

Where: Remote is fine, Portland OR, preferred

Job Description: Vathys is building processors employing novel 3D integration technology, and to do so, will require a significant "advanced packaging" component.

Skills and Qualifications: 1. Experience in integrated circuit packaging, especially "advanced" packaging (must have)

2. Experience in low misalignment tolerance die to die, wafer to wafer and die to wafer alignment (extremely good to have)

3.Experience in "2.5D" and 3D packaging (extremely good to have)

Compensation: Generous compensation will be given to the right talent.

If you're interested, please email tapabrata_ghosh (a t) vathys.ai

---

Comments URL: https://news.ycombinator.com/item?id=18760688

Points: 1

# Comments: 0

from Hacker News: Front Page http://bit.ly/2Q2WC5k
via